Researcher Database

TANI Yasuhiro

Department / Course Research Organization of Science and Technology

Title / Position Visiting Senior Researcher

Papers
1.	2016/04	Proposal of partially conductive diamond abrasives for an electroplated diamond wire │ Proceedings of 16th International Conference & Exhibition of the European Society for Precision Engineering & Nanotechnology (EUSPEN 2016) │ ,pp.455-456
2.	2015/10	Development of high performance polishing slurry for glass │ Proceedings of LEM21 2015 the 8th International Conference on Leading Edge Manufacturing in 21st Century │ ,pp.1-4
3.	2015	New slicing method for Si ingots using wet etching assisted by wire friction │ Proceedings of the 6th International Conference of Asian Society for Precision Engineering and Nanotechnology （ASPEN2015） │
4.	2015	Proposal of Partially Ni-coated Diamond Abrasives for Improving Grindabilities of Diamond Tools，Proposal of Partially Ni-coated Diamond Abrasives for Improving Grindabilities of Diamond Tools │ Proceedings of the 6th International Conference of Asian Society for Precision Engineering and Nanotechnology （ASPEN2015) │
5.	2014/09	Relationship between polishing performance and viscoelasticity of epoxy resin polishing pads │ Transactions of the JSME │ 80 (817),pp.1-11 (Co-authored)
6.	2014/07	Novel lapping plates with a porous structure fabricated by metallic fiber sintering │ The 15th International Conference on Precision Engineering │ ,pp.749-750 (Co-authored)
7.	2014/07	Novel non-woven polishing pad impregnated with epoxy resin │ The 15th International Conference on Precision Engineering │ ,pp.752-753 (Co-authored)
8.	2014/05	Yu ZHANG, Yasuhiro TANI and Junji MURATA │ Transactions of the JSME │ 80 (813),pp.1-12 (Co-authored)
9.	2012/07	Improved Polishing Performance for Glass by a Novel Suede Pad Utilizing Epoxy Resin │ Transactions of the JSME │ 79 (808),pp.494-503 (Co-authored)
10.	2012	Development of a Drum-Type Manufacturing Method for Electroplated Diamond Wire Tools │ Key Engineering Materials │ 523,pp.523-524 (Co-authored)
11.	2012	Development of Composite Abrasives for Various Materials │ Key Engineering Materials │ (516),pp.321-325 (Co-authored)
12.	2012	Improvement of Grooving Performance of the Dicing Blade by Film Reinforcement │ Key Engineering Materials │ (516),pp.240-244 (Co-authored)
13.	2011/06	Development of Composite Abrasives and Epoxy resing Polishing Pads to Reduce the Use of CeO2 Abrasives in Glass Polishing │ Proceedings of 11th International Conference of EUSPEN │ ,pp.136-139 (Co-authored)
14.	2010/05	Four-body Finishing Method Using Hydrophilic Carrier Particles │ Proc. of 10th Int. Conf. of　euspen │ 2,pp.57-60 (Co-authored)
15.	2010	On-machine Method to Condition the Grinding Ability of Resin-Bond Wheels │ Advanced Materials Research │ vols.126-128,pp.159-164 (Co-authored)
16.	2009/11	Development of Cerium Oxide Composite Abrasives for Improvement of Cleanability and Dispersibility │ Proc of 3rd Int. Conf. of ASPEN │ ,pp.1B9-1-4 (Co-authored)
17.	2008/06	Development of an Electroplated Polishing Tape Applying Electrodeposited Nickel Foil Method │ Proc. of the 41st CIRP Conf. on Manufacturing Systems │ ,pp.459-462 (Co-authored)
18.	2007/08	Development of Silica Polyvinyl Alcohol Wheels for Wet Mirror Grinding of Silicon Wafer │ Annals of the CIRP │ 56 (1),pp.361-364 (Co-authored)
19.	2006/11	Development of On-the-Machine Cutting Tool Re-Generating Technology Applying Composite Electroplating –Employment of cobalt matrix and vacuum annealing to produce edge layer with strong adhesiveness- │ Proc. of 8th Int. Conf. on Progress of Machining Technology(ICPMT2006) │ ,pp.225-228 (Co-authored)
20.	2006/08	Development of a High-Porosity Fixed-Abrasive Pad Utilizing Catalytic Effects of TiO2 on Polyurethane Matrix │ Annals of the CIRP │ 55 (1),pp.321-324 (Co-authored)
21.	2006/05	Development of fixed abrasive tools utilizing sol-gel method │ Proc. of 6th euspen International Conference │ ,pp.336-339 (Co-authored)
22.	2006/05	Development of grinding wheels utilizing fibrillation of fluororesin │ Proc. of 6th euspen International Conference │ ,pp.332-335 (Co-authored)
23.	2006/05	Development of grinding wheels utilizing fibrillation of fluororesin │ Proc. of 6th euspen International Conference │ ,pp.332-335 (Co-authored)
24.	2006/03	Investigation on 4-Body Finishing Technology with Polishing Paste │ Key Engineering Materials │ 329,pp.267-272 (Co-authored)
25.	2005/11	Applications of Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers │ Proceedings of International Conference on Precision Engineering and Micro/Nano Technology in Asia │ 11,pp.516-520 (Co-authored)
26.	2005/10	A Study on On-the-Machine Tool Re-Generation Technology-Process development for grinding tools with rapid baking system- │ International Conference on Leading Edge Manufacturing in 21st Century │ ,pp.663-666 (Co-authored)
27.	2005/05	Internal grinding for center hole of zirconia ferrules utilizing an electroplated diamond taper wire │ Proc. of 5th euspen International Conference │ ,pp.545-548 (Co-authored)
28.	2005/01	Development of a Dicing Blade With Photopolymerizable sins for Improving Machinability │ Annals of the CIRP │ 54 (1),pp.293-296 (Co-authored)
29.	2005/01	酸化チタンの添加による高気孔率固定砥粒研磨パッドの開発 │ 日本機械学会論文集（Ｃ編） │ 71 (701),pp.286-291 (Co-authored)
30.	2004/08	Repeatable On-the-Machine Cutting-Edge-Forming Technology Applying Composite Electroplating and Anodic Electrolysis │ Annals of the CIRP │ 53 (1),pp.53-56 (Co-authored)
31.	2004/05	Achievement of high flatness of work piece by polishing method utilizing polymer particles │ Proc. of 4th euspen International Conference │ ,pp.109-110 (Co-authored)
32.	2003/11	Development of Three-Layered Thin Dicing Blade Applying Ultra-Violet Curable Resin │ International Conference on Leading Edge Manufacturing in 21st Century │ ,pp.333-338 (Co-authored)
33.	2003/11	Prevention against adhesion of contamination to end urface of optical fiber connectors in lapping film finishing │ Proc. of 4th euspen International Conference │ ,pp.333-338 (Co-authored)
34.	2003/08	Development of a High-Speed Manufacturing Method of Electroplated Diamond Wire Tools │ Annals of the CIRP │ 52 (1),pp.281-284 (Co-authored)
35.	2002/09	Application of Polymer Particle Assisted Polishing with Oil Dispersion Slurries │ 6th International Conference on Progress of Machining Technology │ ,pp.369-374 (Co-authored)
36.	2002/09	Development of an Ultra-Thin Dicing Blade Applying Ultra-Violet Curable Resin │ The 6th International Conference on Mechatoronics Technology │ ,pp.266-271 (Co-authored)
37.	2002/08	Proposal of New Polishing Technology without Using a Polishing Pad │ Annals of the CIRP │ 51,pp.255-258 (Co-authored)
38.	2002/05	Thickness Measurement of Silicon Wafers Using a Double-Focus Lens │ Proc. of the 3rd International Conference and 4th General Meeting of the euspen │ ,pp.493-496 (Co-authored)
39.	2001/07	Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer │ Proceedings of International Conference on Precision Engineering 2001 │ ,pp.391-395 (Co-authored)
40.	2000/10	Proposal of Magnetic-Field Assisted Cutting for Improvement of Machinability │ The American Society for Precision Engineering │ (Co-authored)
41.	2000/09	Control of Frictional Property of a Polyurethane Pad in Polishing │ Progress of Machining Technology │ ,pp.621-626 (Co-authored)
42.	2000/07	Development of a Dicing Blade Applying Light Sensitive Resin │ Proceedings of 2000　International Conference on Advanced Manufacturing Systems and Manufacturing Automation │ ,pp.154-157 (Co-authored)
43.	2000/01	Possibility of Fixed Abrasive Tools Using UV Resin │ The 5th Joint Workshop on Production Technology │ ,pp.64 (Sole-authored)
44.	1999/08	Development of a resinoid diamond wire containing metal powder for slicing a silicon ingot │ Annals of the CIRP │ 48 (1),pp.273-276 (Co-authored)
45.	1999/05	Mechanical-Chemical Finishing Using a Grinding Stone Including Microcapsules │ Proceedings of the 1st Int. euspen Conf. │ 1,pp.218-221 (Co-authored)
46.	1998/12	Development of a resinoid diamond wire containing metal powdr for slicing silicon ingots │ Proc. of 4th Joint Workshop of Production Technology │ ,pp.51 (Co-authored)
47.	1998/12	Development of a silica polishing Tape for edge finishing of siliconwafers │ Proc. of 4th Joint Workshop on Production Technology │ ,pp.48 (Co-authored)
48.	1998/12	Improvement of tool life of cemented carbide assisted by magnetic field │ Proc. of 4th Joint Workshop on Production Technology │ ,pp.41 (Co-authored)
49.	1998/10	Detection of the Residual of Preceding Machined Surfaces Applying Light Scattering │ Progress of Cutting and Grinding (Proc. of ICPCG’98) │ ,pp.435-440 (Co-authored)
50.	1998/10	Infeed Grinding of Silicon Wafers Applying Electrophoretic Deposition of Ultrafine Abrasives │ Proceedings of the 3rd Japan-India Joint Seminar on "Advanced Manufacturing System │ ,pp.77-80 (Co-authored)
51.	1998/08	Infeed Grinding of Silicon Wafers Applying Electrophoretic Deposition of Ultrafine Abrasives │ Annals of the CIRP │ 47 (1),pp.245-248 (Co-authored)
52.	1997/11	Applications of Light Scattering to Comprehensive Identification of Machined Surfaces │ Proceedings of International Conference on Precision Engineering │ 2,pp.777-782 (Co-authored)
53.	1997/11	Development of Intellectual Process Planning System Using Neural Networks │ Proceedings of the Second India-Japan Workshop on Advanced Manufacturing Systemｓ │ ,pp.89-94 (Co-authored)
54.	1997/11	Precision Truing and Soft Dressing for Spherical Diamond Wheels Using Electrophoretic Phenomenon │ Proceedings of International Conference on Precision Engineering │ 11,pp.375-380 (Co-authored)
55.	1997/08	Ductile Regime Cutting of Brittle Materials Using a Flying Tool under Negative Pressure │ Annals of the CIRP │ 46 (1) (Co-authored)
56.	1997/07	Development of Intellectual Process Planning System Using Neural Networks │ Proceedings of International Conference on Manufacturing Milestones toward the 21st Century　MM21 │ ,pp.487-492 (Co-authored)
57.	1997/05	Developemnt of Chipping-Free Grinding Cut-Off Technology Applying Electrophoretic Deposition of Ultrafine Abrasives │ Proceedings of 9th International Precision Engineering Seminar │ ,pp.532-535 (Co-authored)
58.	1997/03	Identification of Machined Surfaces Applying Laser Scattering │ Proceedings of the 1st Japan-India　Joint Seminar on "Advanced Manufacturing System │ ,pp.141-151 (Sole-authored)
59.	1996/12	of High-Speed and High-Accuracy Straightness Measurement of a Granite Base on a CMM │ 2nd Joint Workshop on Production Technology │ ,pp.165-180 (Co-authored)
60.	1996/11	Evaluation of Accomplishment of Processing Applying Light Scattering Proc. │ Conf. on Progress of Cutting and Grinding │ ,pp.377-382 (Co-authored)
61.	1996/09	Evaluation of Surface Quality Applying Light Scattering │ Proc. of 4th European Congress on Intelligent Techniques and Soft Computing │ 3,pp.1727-1730 (Co-authored)
62.	1996/08	Development of Melamine-Bonded Diamond Wheels with High Porosity for Smooth and Mirror Finishing of Die Materials │ Annals of the CIRP │ ,pp.315-318 (Co-authored)
63.	1996/08	Improvement of Form Accuracy in Axisymmetrical Grinding by Considering the Form Generation mchanism │ Annals of the CIRP │ 45 (1),pp.351-354 (Co-authored)
64.	1996/06	Identification of Machining Conditions Applying Light Scattering │ Proc. 3rd CIRP Workshop on Design and Implementation of IMS │ ,pp.207-213 (Co-authored)
65.	1995/11	dentification of Machined Surfaes Applying Laser Scattering │ Proc. of Int. Conf. on Precision Engg. │ ,pp.275-278 (Co-authored)
66.	1995/08	Development of High-Speed and High-Accuracy Straightness Measurement of a Granite Base of a CMM │ Annals of the CIRP │ 44 (1),pp.465-468 (Co-authored)
67.	1995/05	Nanometer Level of Detection Technology of Initial Contact in Ductile Regime Machining │ Proc. of 8th Int. Precision Engg. Seminar， │ ,pp.390-393 (Co-authored)
68.	1994/08	Development of Highly Homogeneous Pellets Applying Electrophoretic Deposition of Ultrafine Abrasives for Nanometer Grinding │ Annals of the CIRP │ 43 (1),pp.319-.322 (Co-authored)
69.	1993/08	Material Characterization of a Machined Surface Using an Anisotropic Acoustic Lenｓ │ Annals of the CIRP │ 42 (1),pp.627-630 (Co-authored)
70.	1993/07	Mirror Finish of Brittle Materials Using High-oncentration Lapping Discs with Low Bonding Strength │ International Journal of the Soc. of Mat. Eng. for Resources， │ 1 (1),pp.169-176 (Co-authored)
71.	1993/06	Development of High-Concentration Lapping Discs with Low Bonding Strength and their Application to Mirror inishing of Brittle Materials │ JSME International Journal Series C │ 36 (2),pp.264-270 (Co-authored)
72.	1992/11	Phase Characteristics of Self-Excited Chatter in Cutting，Trans. of the ASME │ J. of Engineering for Industry │ 114 (4),pp.393-399 (Co-authored)
73.	1992/11	Single-Point Machining Technology of a Supersmooth Surface Using a Flying Tool │ Nanotechnology │ 3 (1),pp.1-5 (Co-authored)
74.	1992/08	Application of Sintered Plastics to a Porous Vacuum Chuck for Diamond Turning of Aluminum Magnetic Discs │ Annals of the CIRP │ ,pp.133-136 (Co-authored)
75.	1991/11	Mirror Finish of Brittle Materials Using High-oncentration Lapping Discs with Low Bonding Strength │ Proc. Int. Conf. on Materials Engineering for Resources Poster Sessions │ ,pp.33 (Co-authored)
76.	1991/10	超微細砥粒の電気泳動現象を利用した研削切断法の開発 │ 日本機械学会論文集(Ｃ編) │ 57 (542),pp.3320-3325 (Co-authored)
77.	1991/08	Development of Chipping-Free Dicing Technology Applying Electrophoretic　Deposition of Ultrafine Abrasives， │ Annals of the CIRP │ 40 (1),pp.351-354 (Co-authored)
78.	1990/08	Machining Technology of Supersmooth Surface Using a Flying Tool，Proc │ Proc. 2nd Nanotechnology Seminar │ (Co-authored)
79.	1990/08	Nanometer Grinding Using Ultrafine Abrasive Pellets │ Annals of the CIRP │ 39 (1),pp.341-344 (Co-authored)
80.	1990/06	Damage-free Grinding Using Ultrafine Abrasives │ Proc. 2nd Int. Meeting Infrared Tech. and Appl │ (Co-authored)
81.	1989/12	Phase Characteristics of Self-Excited Chatter in Cutting， Computer-Aided Design and Manufacture of Cutting and Forming Tools │ Preprint of the winter annual meeting of ASME │ 40,pp.75-82 (Co-authored)
82.	1989/08	Thickness Measurement of a Metallurgically Damaged Layer on a Ground Surface Using an Acoustic Microscope │ Annals of the CIRP │ 38 (1),pp.549-552 (Co-authored)
83.	1989/03	Experimental Observation of Plastic Deformation Areas， Using an Acoustic Microscope， │ IEEE Trans. on Ultrasonics， Ferroelectrics， and Frequency Control │ 36 (2),pp.274-279 (Co-authored)
84.	1987/08	Quantitative Evaluation of the Heat-Damaged Layer on a Ground Surface Using a Scanning Acoustic Microscope │ Annals of the CIRP │ 36 (1),pp.417-420 (Co-authored)
85.	1987/05	Correlation of Cutting Area with Cutting Force During Self-Excite Vibration │ JSME Int. Jour │ 30 (263),pp.861-867 (Co-authored)
86.	1986/08	Development of a High-Efficiency Finishing Process Using 'Liquid-Bonded Wheel' │ Annals of the CIRP │ 35 (1),pp.215-218 (Co-authored)
87.	1985/10	Application of Acoustic Microscopy to Stress Measurement │ Proceedings International Conference on Experimental Mechanics　in Beijing │ ,pp.596-601 (Co-authored)
88.	1985/09	Application of Reflection Coefficien Dip to Layer Thickness Measurement by Acoustic Microscope │ Japanese Journal of Applied Physics │ 24 (suppl24-1),pp.190-192 (Co-authored)
89.	1984/12	A New Method of Measuring Surface Layer-Thickness Using Dips in Angular Dependence of Reflection Coefficients │ Proc. of IEEE 1984 Ultrasonics Symposium │ 2,pp.656-665 (Co-authored)
90.	1984/08	Development of High-Efficient Fine Finishing Process Using Magnetic Fluid │ Annals of the CIRP │ 33 (1),pp.377-381 (Co-authored)
91.	1984/08	Measurement of Diameter Using Charge Coupled Device (CCD) │ Annals of the CIRP │ 33 (1),pp.377-381 (Co-authored)
92.	1984/08	Self-Excited Chatter and Its Marks in Turning │ Trans. ASME，J.Eng.Ind， │ 106 (3),pp.222-228 (Co-authored)
93.	1983/04	Development of Small Three-component Dynamometer for Cutting Force Meausurement │ Bulletion of the JSME │ 26 (214),pp.650-658 (Co-authored)
94.	1980/08	Analysis of the Mechanism of Face Grinding by Monte Carlo Simulation，Int． │ Int．Conf．on Manufacturing Engingeering │ ,pp.145-149 (Co-authored)